Technologies
Segen Service Tech Ltd. as a result of its successful partnership with prominent companies in the technology sector and therefore meeting the demands of its customers, has excelled in the development of new technologies below:
FAILURE ANALYSIS
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Package Decapsulation - front and back using: chemical, mechanical, laser or plasma precesses.
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Sample Preparation - Sawing, Grinding, Lapping, Polishing.
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Emission Microscopy.
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Thermal Temperature Forcing: Burn-in, Cycling, Shock, HAST.
COATING
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Precision Ultrasonic Spray.
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ALD -Atomic Activation Process.
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Spinners.
VACUUM PROCESSES
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Precise Thermal Profiling - Process in Vacuum Oven.
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Getter activation Process.
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Rapid Thermal Anealing - RTP.
MICRO & NANO MEASUREMENT AND HANDLING
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Mechanical Analysis of Material.
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Manipulator Sustems.
PACKAGING
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IC Package Opening
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Seam Sealer - Electric Welder or Reflow.
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Inert Atmosphere Reflow and Brazing.
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Fluxless and voidless reflow soldering.
WET PROCESSES
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Single Wafer Spinner Equipment.
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Coating, Cleaning' Developing, Etching.
CONSUMABLES
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Sputtering Targets, Back Plated, Evaporation Materials.
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Wafers: Silicon and many other types.
