FAILURE ANALYSIS

  • Package Decapsulation - front and back using: chemical, mechanical, laser or plasma precesses.

  • Sample Preparation - Sawing, Grinding, Lapping, Polishing.

  • Emission Microscopy.

  • Thermal Temperature Forcing: Burn-in, Cycling, Shock, HAST.

COATING

 

  • Precision Ultrasonic Spray.

  • ALD -Atomic Activation Process.

  • Spinners.

Technologies

 

Segen Service Tech Ltd. as a result of its successful partnership with prominent companies in the technology sector and therefore meeting the demands of its customers, has excelled in the development of new technologies below:

VACUUM PROCESSES

  • Precise Thermal Profiling - Process in Vacuum Oven.

  • Getter activation Process.

  • Rapid Thermal Anealing - RTP.

MICRO & NANO MEASUREMENT AND HANDLING

 

  • Mechanical Analysis of Material.

  • Manipulator Sustems.

PACKAGING

 

  • IC Package Opening

  • Seam Sealer - Electric Welder or Reflow.

  • Inert Atmosphere Reflow and Brazing.

  • Fluxless and voidless reflow soldering.

WET PROCESSES

 

  • Single Wafer Spinner Equipment.

  • Coating, Cleaning' Developing, Etching.

CONSUMABLES

 

  • Sputtering Targets, Back Plated, Evaporation Materials.

  • Wafers: Silicon and many other types.

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